Embedded Computing Design

Virtium announced the availability of new DDR5 memory modules that feature higher performance, higher density, and improved power efficiency over previous DDR generations, including enhanced signal integrity and stability for mission critical and data intensive applications.

Imagination Technologies announced Catapult, a RISC-V CPU product line designed from the ground-up for next-generation heterogeneous compute needs.

TDK Corporation announced the availability of InvenSense IAM-20680HT high temperature automotive monolithic 6-Axis MotionTracking sensor platform solution for non-safety automotive applications, which includes the IAM-20680HT IMU MEMS sensor and the DK-20680HT developer kit.

A new Semico Report, Analyzing the RISC-V CPU Market for SIP, SoCs, AI and Design Starts (CC330-21) forecasts that RISC-V-based AI SoCs will have a CAGR for units of 73.6% by 2027.

Texas Instruments (TI) introduced the smallest 24-bit wideband analog-to-digital converter (ADC) that, according to the company,  delivers signal-measurement precision at wider bandwidths than competing ADCs.

Pressure sensor manufacturer Superior Sensor Technology has released a 3D CAD configurator to enhance digital customer experience for design engineers.

Premio Inc. announced support for 5G connectivity in its RCO-6000-CFL family of industrial edge computers.

Microchip Technology announced the expansion of its Gallium Nitride (GaN) Radio Frequency (RF) power device portfolio with new MMICs and discrete transistors that cover frequencies up to 20 gigahertz (GHz).

STMicroelectronics announced the availability of Version 3 of NanoEdge AI Studio, the first major upgrade of the software tool for machine-learning applications that ST acquired with Cartesiam earlier this year. 

videantis announced the achievement of Automotive SPICE Level 2 certification. Automotive SPICE (Software Process Improvement and Capability dEtermination) is a domain specific version of the international Standard ISO 15504 to assess automotive suppliers regarding their capabilities in design, development, testing, and maintenance of software.
 

aiMotive announced the latest release of aiDrive, a scalable, portable high-performance hardware-neutral L2-L4 software stack for AD and ADAS applications.

Infineon Technologies announced that the company’s new AIROC IFW56810 Cloud Connectivity Manager (CCM) solution supports the AWS IoT ExpressLink standards and specifications.

Paragon Software announced the Paragon File System a new, AUTOSAR compliant file system designed with flash memory in mind. Focusing on the longevity and performance of flash memory, the solution fits a range of hardware, from low-resource IoT devices to heavy automotive virtual cockpits.

IAR Systems and Codasip announced their partnership enabling joint customers to build low-power embedded applications based on RISC-V. Following this, version 2.11 of IAR Embedded Workbench for RISC-V now supports the L30 and L50 processors from Codasip.

Siemens Digital Industries Software announced it has enabled several of its electronic design automation (EDA) product families for the latest versions of Samsung Foundry’s advanced processes, including Siemens’ solutions targeting advanced packaging, electrostatic discharge (ESD) rules, and integrated circuit (IC) design in the cloud.

Per the company, SensPro has already been licensed by multiple leading automotive semiconductor players for next-generation automotive SoCs. As an automotive IP supplier, the SensPro safety certification reflects the company’s commitment to a safety-focused design methodology for its processors, tools and software targeting automotive applications.
 

Embedded computing and display solutions provider, Review Display Systems Inc. (RDS), announced the introduction of a new SMARC module from Kontron.

Microchip Technology announced the second development tool offering in its Smart Embedded Vision initiative for designers using its PolarFire RISC-V System on Chip (SoC) Field Programmable Gate Array (FPGA).

Laird Connectivity announced the newest addition to their system-on-module (SOM) portfolio, the Summit SOM 8M Plus based on the NXP Semiconductors i.MX 8M Plus applications processor and 88W8997 wireless SoC.

CAES, a provider of mission critical electronics for aerospace and defense, introduced the industry’s first single-stage, isolated DC-DC converters for high throughput satellite payloads.