Virtium Announces Availability of DDR5 Memory Modules Supporting Industrial Temperatures for Mission Critical Applications
December 07, 2021
News
Virtium announced the availability of new DDR5 memory modules that feature higher performance, higher density, and improved power efficiency over previous DDR generations, including enhanced signal integrity and stability for mission critical and data intensive applications.
DDR5 has a theoretical maximum transfer speed of doubling the rate of DDR4. The overall power consumption is reduced because the supplied voltage has been dropped from 1.2V to 1.1V. In addition, the power management function is moved onto the DIMM, reducing redundant power management circuitry on the motherboard for unused DIMM slots. Plus, its architecture enables future chip density to grow from 16Gb up to 32Gb and beyond, providing headroom and future scalability for DDR5-enabled systems.
The new DRAM modules combine the advanced technology of DDR5 with Virtium’s own low profile design placement technology, manufacturing, and testing processes to ensure that our DDR5 modules can operate reliably in harsh operating environments. The new DDR5s are suitable for handling high-bandwidth workloads in high computing applications such as cloud data centers, networks, and edge deployments.
The new industrial DDR5 memory modules will fully support Intel’s 12th-generation Alder Lake mobile processors, Intel’s Sapphire Rapids and AMD’s AM5 platform, and Zen4 Genoa processors. Virtium offers both 4800MT/s and 5600MT/s solutions, long product availability, and low cost of ownership over time.
Key features include:
- Form Factors: RDIMM, UDIMM and SODIMM
- Capacity ranges from 8GB up to 256GB
- Full industrial temperature (-40ºC to 85ºC), shock and vibration support
- JEDEC standard PC5-4800 (4800MT/s) and PC5-5600 (5600MT/s)
- Provide locked bill-of-materials and advanced product change notification for five years
- Ruggedization options including underfill and conformal coating
- Optional heat spreader and anti-sulfuration
The new DDR5 memory modules will be available in the first quarter of 2022.
For more information, visit: www.virtium.com/
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
