Embedded Computing Design

Infineon Technologies AG announced additional development tools supporting the family of SEMPER NOR Flash devices.

Lauterbach and SYSGO announced the support of SYSGO's brand new product, PikeOS for MPU, within Lauterbach's TRACE32 debug environment. The support includes debugging and tracing PikeOS for MPU applications as well as combined debugging of MMU and MPU based systems.

The MIPI Alliance announced the release of MIPI A-PHY v1.1, the next version of the automotive serializer-deserializer (SerDes) physical-layer interface. 

The Zephyr Project announced a milestone with Baumer joining as a Platinum member and Infineon Technologies, Qualcomm Innovation Center, Inc., Percepio, and Silicon Labs joining as Silver members. 

Light™ and Cadence Design Systems announced that Light has deployed the Cadence Tensilica Vision Q7 DSP for use in Light's Clarity Depth Perception Platform, which provides long-range, high-resolution depth perception using industry-standard cameras benefiting advanced driver-assistance systems (ADAS).

Magnachip Semiconductor Corporation announced that the company has launched 11 new generation high-voltage 600V Super Junction Metal Oxide Semiconductor Field Effect Transistors (SJ MOSFETs).

Superior Sensor Technology announced an extension to its ND Series with two new pressure sensor families for mid pressure range applications.

Toshiba Electronics Europe GmbH launched a new Ethernet bridge IC – the TC9563XBG. It is intended for use in automotive zonal-architecture, infotainment, telematics, or gateways as well as industrial equipment.
 

Rambus Inc. announced that Kyocera Evolution Series MFPs offer data security meeting Federal Information Processing Standards (FIPS) 140-2 Cryptographic Module Validation Program (CMVP) standards using the Rambus RT-130 Root of Trust and AES-IP-38 AES Accelerator IP.

TwinCAT/BSD Hypervisor, a new feature of the TwinCAT/BSD operating system from Beckhoff, enables simultaneous execution of virtual machines and TwinCAT real-time applications on an Industrial PC (IPC).

Semtech Corporation announced a joint initiative with Lacuna Space to further increase coverage and resilience of LoRaWAN connectivity. The collaboration is built on Long Range Frequency Hopping Spread Spectrum (LR-FHSS), the latest addition to the LoRaWAN standard.

Solid Sands announced Update #3 to its SuperTest Vermeer Release. This update supports widespread adoption of the C++ programming language in safety-critical applications with comprehensive C++20 language coverage.

Siemens Digital Industries Software announced the latest update to Siemens’ Simcenter 3D software, part of Siemens’ Xcelerator portfolio of software and services. It enables engineers to tackle the complexity of product development and innovation with advanced simulation.

Aptiv PLC announced a definitive agreement to acquire Wind River from TPG Capital, the private equity platform of global alternative asset management firm TPG, for $4.3 billion in cash.

AccelerComm announced that it has joined Small Cell Forum(SCF), the industry association developing the technical and commercial enablers to accelerate small cell adoption.

TDK Corporation announced that it has successfully shipped prototype heads with next generation recording technology, MAS-MAMR, which is co-developed with Toshiba Corporate R&D Center and Toshiba Electric Devices & Storage Corporation.

TDK Corporation announced the availability of the InvenSense ICM-45xxx SmartMotion ultra-high-performance (UHP) family of 6-axis MEMS motion sensors.

The next-generation robotic development platform enables quick prototyping and development for robotic developers, designers, and enthusiasts, by providing a robust hardware platform accompanied by full ROS1 and ROS2 compliant drivers and software algorithms.

During the 2022 Consumer Electronics Show (CES), Baidu and JiDU Automotive announced that JiDU's first production vehicle model will be powered by the NVIDIA DRIVE Orin SoC (system-on-chip).

At CES 2022, Infineon Technologies AG launched a new generation of its AURIX microcontroller family (MCU).