Embedded Computing Design

Altia announced the release of Altia Design 13.3, the company's flagship editing suite for the creation of embedded graphical user interfaces (GUIs).
 

SAFERTOS, the safety critical real time operating system from WITTENSTEIN high integrity systems (WHIS), is now available for the new AWR2944 and Jacinto TDA4VM platforms from Texas Instruments (TI).

The Khronos Group, an open consortium of companies creating advanced interoperability standards, announced the latest updates to Vulkan, the cross-platform 3D graphics API and its ecosystem.
 

Keysight Technologies, Inc. expanded the company's portfolio of high-speed digital 800G test solutions to enable the optical transceiver ecosystem to improve the power efficiency of components and modules used in data center equipment. 

Analog Devices, Inc. (ADI) introduced the MAX77540 step-down buck converter, which provides single stage power conversion in multi-cell battery applications, such as augmented reality/virtual reality (ARVR) headsets, land mobile radios (LMRs), and digital single-lens reflex (DSLR) cameras.

InnovationLab announced BaMoS, a battery monitoring solution for automotive applications. BaMoS uses ultra-thin printed pressure and temperature sensors to capture detailed battery data down to the individual cell level, which can be used to extend battery lifetime by up to 40%.

SiFive is currently building a new infrastructure to support accelerated ASIC and FPGA design flows, IP delivery, and SoC development.

TDK Corporation introduced the Chirp ICU-10201 and ICU-20201, two new high-performance, ultra-low power integrated ultrasonic Time-of-Flight (ToF) sensors for short- and long-range detection.

TDK Corporation introduced three new digital MEMS microphones as part of the SmartSound family of products for mobile, TWS, IoT and other consumer devices

KIOXIA America, Inc. announced the launch of its Universal Flash Storage (UFS)* Ver. 3.1 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.

Texas Instruments (TI) introduced the industry’s widest-bandwidth high-input-impedance (Hi-Z) buffer amplifier, capable of supporting frequency bandwidths as high as 3 GHz.

G.SKILL International Enterprise Co., Ltd., manufacturer of extreme performance memory and gaming peripherals, announced the launch of an extremely low-latency, high-speed DDR5-6400 CL32 32GB (2x16GB) memory kit under the Trident Z5 family memory series.

Microchip Technology announced the LAN9668 family of TSN switching devices, delivering IEEE standards-compliant features in the industry’s first switching solution enabling lower latency data traffic flows and greater clock accuracy.

Rambus Inc. announced the availability of its PCI Express (PCIe) 6.0 Controller. Optimized for power, area and latency, the Rambus PCIe 6.0 controller delivers data rates up to 64 Gigatransfers per second (GT/s) for high-performance applications.

Silicon Labs announced the BG24 and MG24 families of 2.4 GHz wireless SoCs for Bluetooth and Multiple-protocol operations, respectively, and a new software toolkit. 

Toshiba Electronics Europe GmbH launched a new normally open (NO) 1-Form-A photorelay that is intended for use in a multitude of battery- and hybrid-electric vehicle applications including within the battery management system (BMS), ground fault detection, and identifying faults with mechanical relays.

Weebit Nano Limited announced that together with its development partner CEA-Leti, it has demonstrated its first operational crossbar arrays, a key milestone on the company’s path to creating discrete, stand-alone, non-volatile memory (NVM) chips.

Infineon Technologies AG introduced the EiceDRIVER 2ED4820-EM, a smart gate driver with SPI interface. The gate driver is an ideal companion to Infineon’s 80/100 V OptiMOS MOSFETs. It is also a suitable option for switching high-current loads in a 48 V board net.

Ambarella announced during CES the CV3 AI domain controller family. Per the company, the CVflow family of SoCs provides the automotive industry’s highest AI processing performance, at up to 500 eTOPS, representing a 42x increase over Ambarella’s prior automotive family.

The Khronos Group, together with the European Machine Vision Association (EMVA), announced the formation of a new Khronos Working Group to develop an open, royalty-free API standard for controlling camera system runtimes in embedded, mobile, industrial, XR, automotive, and scientific markets.