Analog Devices Introduces Step-Down Buck Converter that Reduces Space in Multi-Cell Battery Applications
January 31, 2022
News
Analog Devices, Inc. (ADI) introduced the MAX77540 step-down buck converter, which provides single stage power conversion in multi-cell battery applications, such as augmented reality/virtual reality (ARVR) headsets, land mobile radios (LMRs), and digital single-lens reflex (DSLR) cameras.
The power-dense MAX77540 buck converter features 94 percent peak efficiency and wafer level packaging that measures 61 percent smaller than traditional quad flat no-lead packages.
Multi-cell battery applications require two stage power conversion and long battery life in the smallest package possible. Traditional methods, such as using a front-end converter to step down to 5V or below, and subsequently, stepping down further to system level voltages, are inefficient and therefore impact the battery life of the system. This approach requires an additional converter, which often requires an inductor, ultimately driving a larger solution footprint and higher cost.
With the MAX77540, the design engineer can easily create either dual 3A or a single 6A output(s). Default power on configuration only requires two external resistors, and an I2C interface allows further control for advanced power management techniques. External frequency tracking and spread spectrum modulation provide low electromagnetic interference (EMI) power conversions for data sensing and processing equipment.
MAX77540 Buck Converter Key Features:
- Wide 4V to 16V input voltage range and two 3A switching phases provide single step conversions to core voltages from USB-C rails and 2S and 3S multi-cell batteries.
- Wafer level package measures 61 percent (2.5x) smaller than traditional quad flat no-lead packaging to fit in the most space-constrained applications.
- 94 percent peak efficiency measured at 7.4V to 3.3V extends battery life.
Availability and Packaging
|
Product |
Full Production
|
Packaging |
|
MAX77540 |
NOW |
2.51mm x 2.31mm 30-bump wafer-level package (WLP) |
|
NOW |
N/A |
Download data sheet, order samples and evaluation boards: https://bit.ly/MAX77540Product
For more information, visit https://www.analog.com.
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
