CAP-XX Goes No-Battery with its 2.2mm Prismatic 3V Supercapacitor, the DMV750
February 15, 2023
News
Sydney. CAP-XX launched its 750mF DMV750 ultra-thin 2.2mm prismatic 3V supercapacitor delivery efficient storage and distribution of energy to power optimized protocols in space-constrained and mission-critical electronic devices. With support for the general 3V coin cell battery, the supercap will get to a greater maturity, substitute 3V cylindrical supercaps, or remove the need for batteries. Micro-energy harvesting, if enough extraction of solar, vibration, RF, or other environmental energy, will sustain a non-battery environment.
"It's estimated that over 5 billion 3V coin cell batteries and 12 billion IoT devices are sold annually," explained Anthony Kongats, CEO at CAP-XX. "While not all devices require a supercapacitor, many would benefit from our powerful DMV750 supercapacitor to store and release the energy needed for peak power functions like data transmission."
The DMV750 provides 23% more power than a 2.7 volt supercap with similar form factors (21 x 14 x 2.2 millimetres) and has boosted pulse energy reliable battery and non-battery devices. The operating temperature ranges from -20°C to +85°C.
DMV750 includes:
- Energy harvesting for:
- remote wireless sensors
- wireless HVAC sensors
- actuators
- Asset tracking
- RTC and memory backup power
- Peak load shaving when configured in parallel with a 3V coin cell battery
"Our DMV750 ultra-thin 3V supercap provides engineers with multiple options to overcome power delivery challenges in space-constrained, mission-critical, sustainable electronic devices”, continued Kongats.
For more information, visit https://www.cap-xx.com/.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
