Automotive-Grade MEMS Mics Raise the Standard for In-Cabin Audio

By Rich Nass

Contributing Editor

Embedded Computing Design

April 12, 2021

Story

Automotive-Grade MEMS Mics Raise the Standard for In-Cabin Audio

There’s no disputing that the amount of electronics within an automobile is growing at a staggering pace.

I tend to think about the number of processors within the car when I consider the semiconductor content that’s also within. However, one area that’s been somewhat underserved, until now, is the in-cabin microphones. That’s changing, thanks to the availability of two new SiSonic MEMS microphones from Knowles.

The SPH1878 and SPH9855 microphones are engineered specifically for the demands of the automobile environment for hands free calling, advanced voice assistance, and in-cabin noise cancellation. They both follow the AEC-Q100/103 qualification requirements established by the Automotive Electronics Council, the standardization body for establishing standards for reliable, high-quality electronic components for use in the harsh automotive environment.

SPH1878 features both single-ended and differential analog interfaces, while SPH9855 features a PDM digital interface. The two microphones are designed for beam forming applications and are compatible with the European eCall communication system. Key features include low phase distortion for superior noise cancelling performance, high dynamic range for enhanced call and sound quality, an extended operating temperature range for automotive applications, and improved manufacturing stability and traceability.

Both SiSonic MEMS microphones are sampling and are expected to be in production later this year.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

Podcast/Interview Coverage

Sonatus The Garage Podcast

onalytica Interview

Dev Talk with Rich and Vin

Embedded Executive Podcast

Semiconscious Webcast

IEEE Awards Frede Blaabjerg Talks EVS

Atmosic: Embedded Executive: Energy Harvesting Podcast

 

Article Coverage

Embedded AI Isn’t Enterprise AI, and That’s a Good Thing

Tear Down: Google Pixel Watch 4

Protect Your Home from Thieves and Floods

Advantech Teams With AMD To Maximize Performance at the Edge

Tear Down: Noise Luna Ring

 

View additional information

Muck Rack

More from Rich