Application - Automotive - Vehicle Networking & Connectivity
Automotive - Vehicle Networking & Connectivity
NOVOSENSE and Continental to Enhance Vehicle Safety Through Advanced Sensor Co-Development
November 20, 2024
Munich, Germany. NOVOSENSE Microelectronics and Continental Automotive Technologies are partnering on the design of automotive-grade sensors to develop safer vehicle systems including safety functions and system reliability, from airbag triggers to battery pack monitors. A signed memorandum will extend cooperation to the development of sensor ICs as well as for the global integration of NOVOSENSE’s products within Continental’s worldwide platforms.
Automotive - Vehicle Networking & Connectivity
Microchip Technology Announces New VelocityDRIVE™ for Software-Defined Vehicles
October 14, 2024
Microchip Technology announced its new family of LAN969x Multi-Gigabit Ethernet Switches and VelocityDRIVE™ Software Platform (SP), a turnkey Ethernet switch software solution and Configuration Tool (CT) based on standardized YANG models.
Automotive - Vehicle Networking & Connectivity
LeddarTech Joins Ficosa at Autosens Europe With 2/2+ ADAS Solutions
September 20, 2024
Quebec City, Canada. LeddarTech is pleased to join Ficosa at Autosens Europe in Barcelona from October 8-10, 2024. LeddarTech and Ficosa initially began a planned collaboration to design an innovative Intelligent Parking Assistance system in 2022. The result, in 2023, was the integration of LeddarTech’s LeddarVision software with Ficosa’s surround-view camera system and sensors such as radars, IMUs, and GPS.
Vehicle Networking & Connectivity
Automotive
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New UDS Authentication: Enhanced Security, Familiar Challenges
November 01, 2024
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Technical Article - Latest innovation in MEMS pressure
October 23, 2024
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Embedded Executive: Electrification of the Automobile, Infineon
October 23, 2024
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Microchip Technology Announces New VelocityDRIVE™ for Software-Defined Vehicles
October 14, 2024
Debug & Test
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Keysight Technologies Will Exhibit Its Innovations in Electronic Design and Test at electronica
October 31, 2024
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Back to Basics: Moore’s Law and Hardware Obsolescence
October 25, 2024
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GÖPEL Enhances Manufacturing with a One Platform, One Software Solution
October 21, 2024
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Parasoft Earns TÜV SÜD Certification
October 16, 2024
Processing
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Smaller Yet More Powerful: AAEON’s UP 710S Includes Expanded I/O Options
November 19, 2024
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"CROSSROADS: Where the Future Begins" – Samsung Unveils Advanced Semiconductor Tech at Electronica
November 14, 2024
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Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
November 14, 2024
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Optimizing EVs with SiC and GaN Semiconductors
November 06, 2024
Software & OS
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GÖPEL and its SYSTEM CASCON Software Platform Head to electronica
October 23, 2024
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SEGGER to offer Microsoft exFAT with emFile
October 15, 2024
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The Road to embedded world North America: Dojo Five Showcases Advanced Firmware Services and Tools
October 03, 2024
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The Road to embedded world North America: NEXCOM Unleashes the Ingenuity of Software-Defined Edge Computing
October 03, 2024