ATTEND Introduced its Next-Gen MXM 3.0 Connectors for the Edge
June 17, 2024
News
ATTEND launched its high-density PCIe 125B-78C00 and 125A-78C00 MXM connectors to meet the expanding demand for high-performance server system architectures. Featuring a sophisticated design, the devices offer an efficient interface between the carrier board and SMARC, or Qseven modules, ensuring smooth transmission of all I/O signals. With a 0.50 mm pitch, the connector delivers 314 pins for SMARC, and 230 pins for Qseven specifications, safeguarding signal reliability across USB, SATA, PCIe, LVDS, eDP, MIPI, and Ethernet standards.
Features:
- Compatible with the MXM 3.0/2.0 standard
- Mating area: 0.5 mm pitch, space-saving
- 7.8 mm height, module board mating height 5.0 mm from main board
- Carrier connector 314 pins for SMARC specification
- Carrier connector 230 pins for Qseven specification
- Ready for M2.5 nut and screw installation
- Signal integrity such as USB, SATA , PCIe , LVDS , eDP , MIPI , and Ethernet
Ideal Applications
- Embedded systems
- Edge computing
- Industrial PCs
- Servers
- Box PCs
- Routers
- Switches
- Notebook PCs
For more information, visit attend.com.tw.
Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.
