ATTEND Introduced its Next-Gen MXM 3.0 Connectors for the Edge
June 17, 2024
News
ATTEND launched its high-density PCIe 125B-78C00 and 125A-78C00 MXM connectors to meet the expanding demand for high-performance server system architectures. Featuring a sophisticated design, the devices offer an efficient interface between the carrier board and SMARC, or Qseven modules, ensuring smooth transmission of all I/O signals. With a 0.50 mm pitch, the connector delivers 314 pins for SMARC, and 230 pins for Qseven specifications, safeguarding signal reliability across USB, SATA, PCIe, LVDS, eDP, MIPI, and Ethernet standards.
Features:
- Compatible with the MXM 3.0/2.0 standard
- Mating area: 0.5 mm pitch, space-saving
- 7.8 mm height, module board mating height 5.0 mm from main board
- Carrier connector 314 pins for SMARC specification
- Carrier connector 230 pins for Qseven specification
- Ready for M2.5 nut and screw installation
- Signal integrity such as USB, SATA , PCIe , LVDS , eDP , MIPI , and Ethernet
Ideal Applications
- Embedded systems
- Edge computing
- Industrial PCs
- Servers
- Box PCs
- Routers
- Switches
- Notebook PCs
For more information, visit attend.com.tw.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
