Industry News - Page 270
Automotive
-
Auto Audio Gets Upgrade with Cadence Tensilica
February 05, 2026
-
New Standardized Interface Targets Key Challenges in Embedded Audio Design
February 04, 2026
-
Embedded Editor: CES 2026 Trends Roundup
January 19, 2026
-
SOAFEE Blueprint: Enabling AI-Native, Offline-Resilient Vehicle Software with mimik
January 15, 2026
IoT
-
embedded world Germany: NEXCOM Introduces APPC C21-01 Fanless Panel PCs to Bridge Industrial Automation and Edge AI
February 27, 2026
-
The Road to embedded world: ADLINK Highlights Scalable Edge AI Computing from COM Modules to Multi-GPU Servers
February 27, 2026
-
embedded world Germany: MSI IPC Unveils Industrial Edge AI Platforms for Smart Cities and Manufacturing
February 23, 2026
-
Choosing the Right Silicon for Edge AI: How Intel, AMD, NVIDIA, and Arm Are Shaping the Next Generation of Distributed Computing
February 17, 2026
Networking & 5G
-
The Hidden Complexity of Bluetooth Antenna Design in Channel Sounding
March 02, 2026
-
Futuristic Embedded: Hospital AI, Bluetooth in Industrial, and DNA Storage
February 26, 2026
-
Embedded Executive: LE-UWB Touts Low Power Plus High Bandwidth | SPARK Microsystems
February 18, 2026
-
Embedded Executive: Wireless Charging Just Got Faster | WPC
January 14, 2026
Processing
-
The Road to embedded world: congatec “Goes Bigger” With Application-Ready Platforms
February 26, 2026
-
The Road to embedded world: EMASS ECS-DoT SoC Powers Real-Time Edge Inference
February 20, 2026
-
Sundance Will Showcase Thermal-Efficient Efinix Titanium Ti135 FPGA Module at embedded world’ 26, Germany
February 18, 2026
-
Solectrix to Introduce its proFRAME Base Board 3.1 PXIe Targeting Aerospace, Automotive, and Railway Test Applications at embedded world Germany
February 18, 2026