Lumotive Develops Tiny Meta-Lidar Platform

By Rich Nass

Contributing Editor

Embedded Computing Design

November 29, 2021

Blog

Lumotive Develops Tiny Meta-Lidar Platform

According to the company, the Meta-Lidar Platform represents the industry’s smallest solid-state 3D sensing solution.

Aimed at a host of applications, including automotive, industrial, and consumer/mass market, the Lumotive sensor comprises a tiny lidar device with patented beam steering technology, software-defined scan modes, and a reference system design.

The heart of the sensor is Lumotive’s scalable light-control Metasurface silicon chips (LCMs), which are manufactured in a standard CMOS semiconductor process, which is how the company can keep the devices cost-effective and scalable to various sizes, performance levels, and power requirements.

Dubbed the M30, the sensor offers a 10- to 20-m range, a 120- by 90-degree field of view, and a 640- by-480 resolution. The small size, less than 1 cm3, allows it to be integrated into vehicles and robots. Unlike vehicle navigation systems that require long range lidar to detect objects at ranges of 200 meters or more, other mobility and AR applications require less powerful lasers that can scale to smaller sizes, and provide lower costs and less energy consumption. But the traditional approaches that use moving-mirror assemblies are unable to scale.

The scalability is enabled by the LCM solid-state beam steering chips, which reduce the size of lidar systems while improving performance and fidelity. Manufactured in a CMOS semiconductor process, the LCM chips eliminate the need for mechanical moving parts. LCM technology enables software-defined lidar capability, allowing the lidar scan pattern, frame rate and resolution to be customized for specific use cases.

The Lumotive Meta-Lidar Platform is expected to be in commercial production by the end of 2022.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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