Empower Semiconductor Ships Its Latest 3.3 V IVRs

By Rich Nass

Contributing Editor

Embedded Computing Design

May 16, 2023

Blog

Empower Semiconductor Ships Its Latest 3.3 V IVRs

Empower Semiconductor, a supplier of integrated voltage regulators (IVRs), has commenced production and customer shipments of its quad-output step-down converters that combine what it claims is the industry’s highest power density and fastest transient response. The EP71xx series of power management ICs takes advantage of the company’s high-speed power architectures to eliminate all external components and deliver a compact, high performance solution.

The family initially offers eight different products in single- to quad-output channel configurations and various power levels per output, suiting it to power a wide variety of FPGAs, DSPs, and multi-power domain architectures. Applications that fit this bill include data centers, telecommunications, home and factory automation, and ferromagnetic-sensitive medical applications.

The EP71xx series delivers 12 A of continuous current in a package that measures 5 x 7 x 0.7 mm and requires no external components. It operates from a standard 3.3 V input power rail and provides a single to quad output channel. The low height allows them to be placed on either side of the PCB and close to the load for maximum performance.

An I2C interface allows for dynamic device configuration that can be saved in its non-volatile memory for I2C free power up operations. Controlled power up and power down is achieved via an on-board sequencer that sets full timing and slew rates on all rails. A full suite of telemetry functionality reporting voltage, current, and die temperature complements an array of protection features by providing remote diagnostic capabilities.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

Podcast/Interview Coverage

Sonatus The Garage Podcast

onalytica Interview

Dev Talk with Rich and Vin

Embedded Executive Podcast

Semiconscious Webcast

IEEE Awards Frede Blaabjerg Talks EVS

Atmosic: Embedded Executive: Energy Harvesting Podcast

 

Article Coverage

Embedded AI Isn’t Enterprise AI, and That’s a Good Thing

Tear Down: Google Pixel Watch 4

Protect Your Home from Thieves and Floods

Advantech Teams With AMD To Maximize Performance at the Edge

Tear Down: Noise Luna Ring

 

View additional information

Muck Rack

More from Rich