Rectify Auto Applications with Vishay
June 26, 2023
News
Malvern, Pennsylvania. Delivering an impressive high current rating of up to 5A, Vishay is now incorporating four new 200 V FRED Pt ultrafast rectifiers within the DFN3820A package. The series includes the 1 A VS-1EAH02xM3, 2 A VS-2EAH02xM3, 3 A VS-3EAH02xM3, and 5 A VS-5EAH02xM3, and individually available in Vishay Automotive Grade, AEC-Q101 qualified versions.
Vishay inaugurated the DFN3820A highlighting a minute footprint of 3.8 mm by 2.0 mm with a height of just 0.88 mm. The design aids semiconductors in maximizing PCB space. Advanced thermal performance is created by a copper mass design and an advanced die placement technology delivering higher current ratings for applications.
When juxtaposed with the SMP (DO-220AA) package and form factor, the four new solutions support a 12 % lower profile surpassing twice the current rating and offer an equal or additional current than larger devices in general SMB (DO-214AA) and SMC (DO-214AB) packages, as well as the eSMP series SlimSMA (DO-221AC), SlimSMAW (DO-221AD), and SMPC (TO-2778A).
The rectifiers deliver reverse leakage current down to 1 μA with operating temperatures running between -55 °C to +175 °C. Efficiency is boosted with low forward voltage drop down to 0.71 V. Wettable flanks of the DFN3820A package enables automatic optical inspection (AOI) which eliminates the need for an X-ray inspection.
Highlights include MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of 260 °C and are RoHS-compliant and halogen-free with its matte tin-plated leads meeting the JESD 201 class 2 whisker test.
Automotive applications include but are not limited to:
- ECU
- ADAS
- Lidar
- ABS
- BMS
- EV
For more information, visit vishay.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
