Uhnder and dSPACE Establish Cooperation for Radar Technology Development
April 21, 2020
Both companies will support each other in the continuous development of sensors and validation solutions.
Uhnder and dSPACE have agreed to cooperate to ensure that the developments in radar sensor technology can keep pace with the safety requirements in traffic. Both companies will support each other in the continuous development of sensors and validation solutions.
Uhnder has developed a digital Radar-on-Chip (RoC), using a combination of advanced CMOS and Digital Code Modulation (DCM) technology. Uhnder's 4D, digitally-modulated radar chip offers performance by integrating 192 virtual channels onto a single chip and pioneers High Contrast Resolution (HCR), which provides improved range and angular resolution and makes it possible to separate small radar reflectors from proximate large reflectors.
Throughout the development process, Uhnder relies on dSPACE Automotive Radar Target Simulators to subject sensors, whose signals are processed using this modulation method, to the most realistic tests possible until the sensors are approved for series production.
Uhnder and dSPACE will present results of their partnership with demos at trade fairs. The first joint showcases will take place at the "International Conference on Microwave Intelligent Mobility 2020" in Linz (July 2020, exact date not fixed yet) and at the "European Microwave Week 2020" in Utrecht (September 13-18, 2020).
For more information, visit: https://www.dspace.com/en/inc/home.cfm