The Road to embedded world ’23: Dresden, Germany, Fraunhofer
March 06, 2023
News
If you are heading to embedded world 2023 and looking for an innovative OLED microdisplay, make a stop by hall 4 booth 422 where the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will have them available for demonstration.
The design of application- and customer-specific microdisplay chips are made possible by means of integrated circuit design, industry-compatible, and a standardized manufacturing process technology that has been developed to utilize testing and characterization methods. For the latter, a 64-device microdisplay test unit for characterization upon delivery or/and receipt of goods by customers will now be presented for the first time at embedded world 2023.
For more information, visit fep.fraunhofer.de.
Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.
