The Road to embedded world ’23: Dresden, Germany, Fraunhofer
March 06, 2023
News
If you are heading to embedded world 2023 and looking for an innovative OLED microdisplay, make a stop by hall 4 booth 422 where the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will have them available for demonstration.
The design of application- and customer-specific microdisplay chips are made possible by means of integrated circuit design, industry-compatible, and a standardized manufacturing process technology that has been developed to utilize testing and characterization methods. For the latter, a 64-device microdisplay test unit for characterization upon delivery or/and receipt of goods by customers will now be presented for the first time at embedded world 2023.
For more information, visit fep.fraunhofer.de.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
