Dialog Semiconductor Releases SmartBond TINY Module for IoT Development

By Perry Cohen

Associate Editor

Embedded Computing Design

April 20, 2020


Dialog Semiconductor announced the release of the DA14531 SmartBond TINY module for the development of connected devices.

Dialog Semiconductor announced the release of the DA14531 SmartBond TINY module for the development of connected devices.

The new module was designed to help reduce the cost of adding Bluetooth functionality in IoT systems. According to the company, the module incorporates two software features designed to eliminate the complexity associated with traditional Bluetooth low energy development and allows engineers to develop robust IoT products regardless of their software coding capabilities.

The Dialog Serial Port Service (DSPS) copies a universal asynchronous receiver-transmitter (UART) serial port over BLE. This eliminates the need to write Bluetooth software for BLE Pipe applications while it’s connecting a module to the host MCU serial port. Dialog’s codeless software replaces complex code with human-readable ASCII commands. Per the company, codeless uses the industry standard Hayes AT-style command set to configure and operate the module.

The module is fully certified for worldwide operation. Certifications include FCC certification for the Americas and CE certification for Europe

For more information, visit https://www.dialog-semiconductor.com/products/bluetooth-module-da14531-smartbond-tiny.

Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation, podcast production, and social media efforts. Perry has been published on both local and national news platforms including KTAR.com (Phoenix), ArizonaSports.com (Phoenix), AZFamily.com, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university.

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