Go device to cloud in just 25 kbytes

By Rich Nass

Contributing Editor

Embedded Computing Design

March 22, 2017

Go device to cloud in just 25 kbytes

Of course good things come in small packages. We all know that. And that’s sort of the case with Express Logic’s X-Ware industrial-grade IoT device-to-cloud connectivity platform. It obviously...

Of course good things come in small packages. We all know that. And that’s sort of the case with Express Logic’s X-Ware industrial-grade IoT device-to-cloud connectivity platform. It obviously doesn’t ship in a physical package, but it does boast very small size, potentially just 25 kbytes. It’s designed for fast, safe, secure, industrial-grade connectivity of deeply embedded IoT sensors, devices, edge routers, and gateways.

The X-Ware IoT Platform is built on top of the company’s popular ThreadX RTOS and NetX Duo dual IPv4/IPv6 TCP/IP stack. The X-Ware IoT Platform leverages all the benefits of NetX Duo and introduces new IoT protocol support for 6LoWPAN, MQTT, CoAP, LWM2M. Sounds like an alphabet soup of acronyms, but if you’re supporting them, I’m sure you know what they stand for.

The X-Ware IoT Platform doesn’t contain any open-source code, as its completely written in-house. That’s obviously more important to some people than others, depending on what your application is and where it’s headed.

One advantage of having the small size is that it offers space to add a security layers, such as Express Logic’s NetX Secure TLS or DTLS to secure data at the socket layer or NetX Duo IPsec to secure data at the network layer. NetX Duo has been precertified at the highest level for safety medical, industrial, automotive, rail, and consumer appliance standards.

X-Ware IoT Platform is available today in a pre-release version, with the full production release coming in June 2017. NetX Duo is available today at license prices starting at $15,000.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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