Vishay Intertechnology Launches 4-Quadrant Silicon PIN Photodiode in Surface-Mount Package, Qualified for Automotive Applications
December 14, 2020
News
The AEC-Q101 qualified device released features four monolithic PIN diodes, each with an active area of 1.6 mm², integrated into a single 4.72 mm by 4.72 mm by 0.8 mm top-view, surface-mount package.
The Optoelectronics group of Vishay Intertechnology introduced the industry's first 4-quadrant silicon PIN photodiode in a standard surface-mount package, qualified for automotive applications. Combining high photo sensitivity with low 0.1 % crosstalk and virtually no tolerance between its segments, the Vishay Semiconductors K857PE enables a variety of sensor and control applications for the automotive, consumer, and industrial markets.
The AEC-Q101 qualified device released features four monolithic PIN diodes, each with an active area of 1.6 mm², integrated into a single 4.72 mm by 4.72 mm by 0.8 mm top-view, surface-mount package. The sides of the K857PE's package are opaque, which, according to the company, eliminates stray light irradiating the photodiodes, resulting in suitable signal to noise ratio. The device's linear photo response enables small signal detection for automotive rain / light sensors, industrial automation systems, laser beam alignment, and virtual reality applications.
Built on epitaxial technology, the photodiode offers a sensitivity range from 690 nm to 1050 nm, with 8.5 µA reverse light current per segment at Ee = 1 mW/cm² and an 850 nm wavelength. The device features a daylight blocking filter, ± 60° angle of half sensitivity, and operates over a temperature range of -40 °C to +110 °C. RoHS-compliant, halogen-free, and Vishay Green, the K857PE offers a floor life of 168 h in accordance with J-STD-020.
The new 4-quadrant photodiode are available now, with lead times of 10 weeks for production quantities. Pricing for U.S. delivery starts at $1.10 per piece in 1,000-piece quantities.
For more information, visit: https://www.vishay.com/
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
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Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
