COM Express Reunion for Acrosser's Family of Modules

By Chad Cox

Production Editor

Embedded Computing Design

October 13, 2023


COM Express Reunion for Acrosser's Family of Modules
Type 6: ACM-XE21B6

Acrosser has a complete line of COM Express embedded computing solutions that consists of the ACM-XE21B6, ACM-ICLDE7, ACM-TGLUE0, ACM-EL6KA. The new devices are powered by Intel and come with a host of options and benefits for creating new and efficient designs for COM Express environments.

Type 6: ACM-XE21B6

Type 6 COM Express module was created with flexibility and compatibility. The modules are ideal for industrial automation and medical devices.


  • Newest platform and highest performance COM Express Basic Type 6
  • The Intel CM246 Chipset
  • Intel Core i7- 9850HE/Xeon 2176M Processor
  • Support Two DDR4 SODIMM , up to 64GB
  • 24 PCI-e Lanes
  • 1x GbE

Type 7: ACM-ICLDE7

The Type 7 can handle the most extreme environments and continue to operate reliably when the need arises. With environmental changes, the Type 7 continues to retain its high-speed connectivity applications.


  • Intel SoC XEON™ D LCC series, max TDP 70W
  • DDR4 socket x4
  • Gigabit Ethernet x 1, 10 GbE x4
  • No Display, No Audio
  • SATA x 2, USB3.0/2.0 x4
  • 1x PCIe[x16], 1x PCIe[x8] + 4x PCIe[x2]
  • GPIO x8, SMbus, I2C, LPC
  • COM Express Basic size, Type 7, 125mmx95mm

Type 10: ACM-TGLUE0 and ACM-EL6KA

Both ultra-compact Type ten modules are designed to weather the harshest environments on the edge. They are ideal for applications that include military, aerospace, and outdoor applications.


  • 11th Generation Intel Core Processor Family(formerly Tiger Lake UP3)
  • Onboard LPDDR4x Memory 16 GB
  • 2.5 Gigabit Ethernet x 1
  • eDP x 1 , DDI x 1
  • High Definition Audio Interface
  • SATA3.0 x 2 , onboard PCIe SSD 64GB
  • USB 2.0 x 8, USB 3.2/2.0 x 2 (up to USB 3.2 Gen 2 support)
  • 4 x PCI-Express x 1
  • COM Express Type 10, Mini Size, 84 mm x 55 mm


  • Intel Atom x6000E, Pentium, Celeron series Processor
  • Onboard Memory LPDDR4, up to 16GB
  • Intel i226IT 2.5GbE x 1
  • 18/24-bit Single Channel LVDS/eDP, DDI x 1
  • SATA3 x 2 , Onboard eMMC up to 64GB (Optional)
  • USB 2.0 x 8, USB 3.2 10Gbps x 2
  • PCIe [x1] x 4
  • COM Express Mini Size, Type 10, COM.0 R2.1

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Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.

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