Based on micro-pattern trench technology, the TRENCHSTOP IGBT7 chip offers lower static losses compared to the IGBT4, with an on-state voltage reduced by 20 percent. The power modules feature a maximum allowed overload junction temperature of 175°C. Additionally, they are marked by softer switching and an improved controllability.

The new 1200 V TRENCHSTOP IGBT7 modules are designed with the same pin out as TRENCHSTOP IGBT4 modules but enable a higher output current in the same package, or the similar output current in a smaller package. All module types are equipped with Infineon’s reliable PressFit mounting technology for low ohmic resistance and reduced process time.

The TRENCHSTOP IGBT7 technology is offered in an industry-standard EasyPIM housing for the current classes 10 A and 25 A. For more power, the EasyPACK 2B carries 100 A. Lead types are FP10R12W1T7_B11, FP25R12W1T7_B11 and FS100R12W2T7_B11. 

For more information, visit www.infineon.com.