Samsung at Embedded World 2018
March 02, 2018
Video
Rich Nass, EVP of Editorial, interviews James Stansberry from Samsung in booth 3A-438 at Embedded World #ew18 #iot @embedded_world
AI & Machine Learning
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AAEON Partners with The Imaging Source For Rugged AI Vision Solutions
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Beyond the Lab: Why Voice AI Must Be Benchmarked Under Real-World Conditions
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Embedded Executive: TinyML Could Get You Over the AI Hurdle | Shawn Hymel
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DevTalk with Rich and Vin: AI and embedded world North America
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IoT
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Antenova’s Petrosa Antenna Delivers High-Performance Wi-Fi 7 Connectivity Without Clearance Requirements
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ADLINK: MXA-312M
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Embedded Executive: Support the IoT—Everywhere | Ayla Networks
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Product of the Week: ADLINK Technology’s MXA-312M Edge Computing Platform
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Storage
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Rambus Unveils DDR5 9600 RDIMM Chipset for Next-Generation AI and HPC Workloads
July 09, 2026
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Advancing Flash Memory Performance for the Edge AI Era
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Floadia Introduces G1 Automotive eFlash IP on TSMC 180BCD Gen3 for Cutting Edge Vehicle Electronics
June 22, 2026
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Biwin Brings Storage and Memory Innovation to COMPUTEX 2026
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Networking & 5G
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Akasa Releases 10 Gigabit PCIe NIC for Desktops, Servers, and Workstations
April 24, 2026
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HighPoint Technologies Introduces Rocket 1604L Retimer-Based PCIe M.2 Add-In-Card for High-Speed AI Environments
April 21, 2026
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7STARLAKE Releases THOR11-H6/X6 1U Servers with Intel Xeon D for AI and Defense Edge
April 06, 2026
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Digi International Launches Digi IX25: Rugged 5G Router for Industrial IoT and Critical Infrastructure
April 06, 2026