The Road to embedded world: Samtec’s Scaling Performance with COM-HPC
February 24, 2025
News
Visit Booth 4A-324 at this year’s embedded world to witness Samtec’s COM-HPC connectors and see how they are constructed for evolving standards Built on Samtec’s AcceleRate HP High-Performance Arrays, COM-HPC Server and Client modules integrate two 400-pin connectors, providing 800 pins in total with the COM-HPC Mini module omitting one of these connectors.
Samtec COM-HPC connectors enable PCIe 5.0 (32 Gbps), PCIe 6.0 (64 Gbps PAM4), 25 GbE, 40 Gbps USB4/Thunderbolt, and 80 Gbps DisplayPort. Pinout designs are optimized for Mini, Client, and Server modules within the COM-HPC framework.
In every application, the female Module Receptacles remain at a standard height, with male Carrier Plugs available in configurations supporting either a 5 mm or 10 mm stack height.
Offering superior scalability and performance, PICMG COM-HPC exceeds the high-speed demands of embedded CoMs/SoMs while complementing the COM Express specification for advanced embedded system development.
COM-HPC consists of two primary module types, server modules for edge computing and client modules for embedded applications. The COM-HPC 1.2 update introduced a compact client form factor, COM-HPC Mini, while version 1.3 will define PCIe 6.0 performance details.
Supporting up to 1 TB of system memory, COM-HPC enables greater flexibility by incorporating compute engines beyond x86, such as RISC-V CPUs, GPGPUs, FPGAs, and DSPs.
To secure your free ticket to embedded world, click here: https://www.messe-ticket.de/Nuernberg/embeddedworld2025/Register/SYS4ew25?culture=en
For more information, visit samtec.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
