Add Low Power and Mesh Networking to the Latest Bluetooth Innovations

By Rich Nass

Contributing Editor

Embedded Computing Design

September 15, 2020

News

There's no denying the impact Bluetooth has had on the lives of consumers, and to the credit of the embedded community, innovation continues to occur in that space, at a healthy pace.

There’s no denying the impact Bluetooth has had on the lives of consumers, and to the credit of the embedded community, innovation continues to occur in that space, at a healthy pace. Those innovations come both in terms of new releases to the specifications as well as the products that meet those specifications.

Smaller, lower power, and longer ranged products continue to rain down from the silicon vendors. One good example of those innovations is the recently announced BGM220 series from Silicon Labs, which supports Bluetooth 5.2 with mesh networking capabilities.

The device is actually a system-in-package (SiP), as it also holds both the Bluetooth radio and an Arm-based CPU. Its small size (6 by 6 mm) and low power consumption, a ten-year battery life from a coin-cell battery, make it ideal for end products like wearables, asset tags, and other small form-factor applications.

According to the company, the devices are among the first to support Bluetooth Direction Finding, which provide them the ability to detect the direction of a Bluetooth signal. The processor core that’s employed is an Arm Cortex-M33 with TrustZone, running at 77 MHz. Other peripherals include dual USARTs and dual I2C interfaces, as well as a 12-bit ADC and a temperature sensor.

Two different modules are available: the aforementioned 6- by 6-mm BGM220S and the lower cost 13- by 15-mm BGM220P. Both contain an integrated antenna, which removes a significant headache for the design team.

At the same time, SiLabs is releasing an enhanced version of its developer suite, Simplicity Studio 5, with software IoT developers can more easily design IoT products across various wireless protocols. It contains a new interface and provides a simplified and intuitive out-of-the-box experience, regardless of your target operating system.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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