GreenWaves? Ultra-Low Power GAP9 IoT Apps Processor Suits Intelligence at the Edge

By Rich Nass

Contributing Editor

Embedded Computing Design

January 21, 2020

News

GreenWaves? Ultra-Low Power GAP9 IoT Apps Processor Suits Intelligence at the Edge

GAP9 lets OEMs embed machine learning and signal processing capabilities into battery-powered or energy-harvesting devices.

GreenWaves Technologies, a fabless semiconductor vendor focused on ultra-low power edge-based AI processing, recently announced a new member of its GAP IoT application processor family, the GAP9. This latest member combines architectural enhancements using Global Foundries 22-nm FDX process to deliver a peak cluster memory bandwidth of 41.6 Gbytes/s and up to 50 GOPS combined compute power at an overall power consumption of 50 mW.

GAP9 lets OEMs embed machine learning and signal processing capabilities into battery-powered or energy-harvesting devices. This could include IoT sensors in smart buildings or medical wearable devices.

Building on the company’s GAP8 architecture, GAP9 adds support for floating-point arithmetic across all cores based on a transprecision floating-point unit capable of handling floating-point numbers in 8-, 16-, and 32-bit precision with support for vectorization. GAP9 also extends support for fixed-point arithmetic using vectorized 4-bit and 2-bit operations. This positions GAP9 for applications that can take advantage of deep levels of quantization.

GAP9 incorporates bi-directional multichannel, synchronized digital audio interfaces, suiting it for wearable audio products. It also incorporates both CSI-2 and parallel camera interfaces. Other enhancements include the GAP AutoTiler, allowing automatic code generation for neural network graphs and GAPFlow, a series of tools for automating the conversion of neural networks from training packages such as Google TensorFlow.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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