Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
January 21, 2021
News
Siemens announced that its tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.
With this certification, customers can now verify their early-stage AMS designs using the Analog FastSPICE (AFS) platform on Samsung’s process technology. Samsung’s 3nm GAA platform is engineered to reduce total silicon size, use less power, and improve performance over previous process nodes.
According to the company, with this new certification, the AFS platform is now enabled in Samsung Foundry’s device models and design kits. Mutual customers rely on the AFS platform to deliver nanometer-scale SPICE accuracy while verifying analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits faster than with traditional SPICE simulators.
For more information, visit: www.sw.siemens.com
Tiera Oliver, Assistant Managing Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She develops content and constructs ECD podcasts, such as Embedded Insiders. Before working at ECD, Tiera graduated from Northern Arizona University, where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student-led newspaper, The Lumberjack.
