Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
January 21, 2021
News
Siemens announced that its tools for the verification of analog/mixed-signal (AMS) circuits are now qualified for early design starts on Samsung Foundry’s new 3nm Gate All Around (GAA) process technology.
With this certification, customers can now verify their early-stage AMS designs using the Analog FastSPICE (AFS) platform on Samsung’s process technology. Samsung’s 3nm GAA platform is engineered to reduce total silicon size, use less power, and improve performance over previous process nodes.
According to the company, with this new certification, the AFS platform is now enabled in Samsung Foundry’s device models and design kits. Mutual customers rely on the AFS platform to deliver nanometer-scale SPICE accuracy while verifying analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits faster than with traditional SPICE simulators.
For more information, visit: www.sw.siemens.com
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
