Nexperia Expands its Wide Bandgap Semiconductor Offering With New Family of High-Performance Silicon Carbide (SiC) Diodes

By Tiera Oliver

Associate Editor

Embedded Computing Design

November 23, 2021


Nexperia Expands its Wide Bandgap Semiconductor Offering With New Family of High-Performance Silicon Carbide (SiC) Diodes

Nexperia announced its entry into the high-power Silicon Carbide (SiC) diodes market with the introduction of 650 V, 10 A SiC Schottky diodes.

This is a strategic move for Nexperia, a supplier of efficient power Gallium Nitride (GaN) FETs, to expand its high-voltage wide bandgap semiconductor device offering.

Nexperia’s first SiC Schottky diode is an industrial-grade device with 650 V repetitive peak reverse voltage (VRRM) and 10 A continuous forward current (IF), designed to combine ultra-high performance and high efficiency with low energy loss in power conversion applications. Providing the added benefit of a high-voltage compliant real 2-pin (R2P) package with higher creepage distance, it is available in a choice of surface mount (DPAK R2P and D2PAK R2P) or through-hole (TO-220-2, TO-247-2) devices.

Engineering samples are available on request with a full product release planned for the second quarter of 2022. Nexperia plans to increase its portfolio of SiC diodes, which will lead to a total of 72 products operating at voltage levels of 650 V and 1200 V and with currents in the range of 6-20 A.

Nexperia’s SiC Schottky diodes initially target industrial and consumer applications including:

  • Switch Mode Power Supply (SMPS)
  • AC-DC and DC-DC converters
  • Battery charging infrastructure
  • Uninterruptible Power Supply (UPS)
  • Photovoltaic inverters

Nexperia also plans to release automotive-grade devices for use in vehicle electrification applications such as:

  • On-board Chargers (OBC)
  • Inverters
  • High-voltage DC-DC converter

The PSC1065H (-J/-K/-L) is the first in a portfolio of SiC Schottky diodes that Nexperia is developing to address the automotive and industrial markets.

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Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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