Littelfuse Delivers Single-Chip eFuse Protection ICs
April 10, 2023
News
Chicago, Illinois. Littelfuse released four flexible circuit protection devices in the eFuse Protection ICs product line. The semiconductor-based eFuse Protection ICs are developed for a variety of power inputs including 3.3V to 28V with reliable embedded security. The fuses protect from inrush current, overvoltage, overcurrent, and short circuit. Real-time diagnostics is supported as well as under voltage lockout (UVLO), overtemperature protection, reverse current blocking, and soft start.
Flexibility is important when designing, the devices enable developers to adjust and limit current as their environment requires. "The expanded eFuse Protection ICs product line delivers clear performance advantages for electronics designers," said Bernie Hsieh, Assistant Product Manager of the Protection Semiconductor Business team at Littelfuse. "Compared to traditional fuse, PTCs, power switches, and discrete solutions like Schottky diode and MOSFET combinations, the eFuses provide exceptional integration, adjustability, flexibility, and reliable protection features in highly compact form factors that save PC board space."
eFuse Protection ICs:
LS0504EDD12 - 5V, 4A, low Ron power distribution load switch, DFN1.2x1.6 package
LS12052BD33 - 18V, 5A, overvoltage and blocking FET control, DFN2x2 package
LS2405IDD23 - 24V, 5A, very low forward voltage diode, low profile 8 lead DFN 2x3 package
LS24062RQ23 - 28V, 6A, bidirectional, dual port independent current limit setting, 16 lead QFN 2.5x3.2 package
Application areas include:
- Bluetooth devices
- USB Type-C cables
- Enterprise servers
- Power tools
- Industry
- POS
For more information, visit littelfuse.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
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Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
