Akasa Skyline 3 Pro Delivers Passive Cooling Fanless Design for ASUS Tinker Board SBCs
December 23, 2025
News
Akasa released the compact (68.4 x 96 x 37.3 mm) Skyline 3 Pro, an aluminum fanless case with a skyline-shaped top cover and engineered to allow full access to the ASUS Tinker Board 3 and 3S single-board computers (SBCs) interfaces.
The Skyline 3 Pro’s sandblasted, anodized aluminum body also serves as a passive heatsink. According to the press release, the thermal module and included thermal pads draw heat away from the SBC’s “hot zones” and dissipate it into the surrounding air through the sculpted “skyline” ridged heatsink fins, which are designed to maximize surface area for effective cooling.
It is ideal for digital signage, edge AI, IoT, smart retail/kiosk, medical and other applications needing a solution that requires maintenance-free operation in quiet environments.
For more information, visit akasa.co.uk/search/SKYLINE+3+PRO.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
