COMPUTEX Taipei: congatec works to bring high-end OEM to APAC market

By Brandon Lewis

Editor-in-Chief

Embedded Computing Design

June 06, 2015

Like many of the engineers enlisted at congatec, Bryan Lin, VP of Sales and Marketing, Asia, at congatec has roots in the embedded board space that ca...

Like many of the engineers enlisted at congatec, Bryan Lin, VP of Sales and Marketing, Asia, at congatec has roots in the embedded board space that can be traced back to Kontron and Advantech, but his mission with congatec is a new one – bring high-end embedded modules to the typically low-margin APAC market. To achieve this, Lin and his team are working to establish the German company’s quality reputation in the Far East through the company’s selection of computers-on-module (COMs), the only board type they offer, as well as congatec’s global design and full lifecycle support.

Lin admits, as others did, that the future of the IPC market lies in customization and services, whereas in the past it has focused on standards. With this in mind, congatec has equipped itself and its clients with both ARM and x86 capabilities, evident in their Qseven and COM Express products. Specifically, the conga-QA3 Qseven COM is part of an IoT starter kit that includes the “Intel Gateway Solutions for IoT” package, individually available starting around $1,000.

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Brandon Lewis, Technology Editor

Brandon is responsible for guiding content strategy, editorial direction, and community engagement across the Embedded Computing Design ecosystem. A 10-year veteran of the electronics media industry, he enjoys covering topics ranging from development kits to cybersecurity and tech business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached at [email protected]

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