Gowin Semiconductor Embeds 64Mb HyperRAM DRAM from Winbond for AI Edge Computing Solution
January 18, 2021
News
Winbond Electronics announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.
Winbond Electronics announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.
GoAI 2.0 is a complete, new hardware and software solution for machine learning applications. Compatible with the TensorFlow machine learning development environment, GoAI 2.0 is aimed at edge computing applications such as smart door locks, smart speakers, voice-activated devices, and smart toys.
The hardware component of the GoAI 2.0 platform, the GW1NSR4, is a system-in-package (SiP) featuring a FPGA and ARM Cortex M3 microcontroller for the machine learning application supported by Winbond’s 64Mb HyperRAM supplied in known good die (KGD) format.
Per the company, the Winbond DRAM based on HyperRAM technology is ideal for Gowin’s target applications, in which the electronics circuit needs to be made as small as possible, while providing storage and data bandwidth to support compute-intensive workloads such as keyword detection or image recognition. Also, per the company, Winbond’s 64Mb HyperRAM product has connected 11 signal pins, so its connections to the host FPGA is minimal. The GW1NSR4 SiP has a footprint of 4.2mm x 4.2mm in a BGA package. The 64Mb memory capacity provided by the Winbond device is sufficient to run both an operating system and to concurrently operate as buffer memory for a TinyML model, or as a frame buffer.
The performance specifications of the Winbond’s 64Mb HyperRAMinclude maximum data bandwidth of 500MB/s. It also offers ultra-low power consumption in operating and hybrid sleep modes.
Winbond’s HyperRAM products are available for high-volume production in densities of 512Mb, 256Mb, 128Mb, 64Mb and 32Mb.
For more information, visit: www.winbond.com
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
