Sondrel Launches the Fourth IP Platform, SFA 350A, for ADAS ASICs

By Tiera Oliver

Associate Editor

Embedded Computing Design

June 03, 2021


Sondrel Launches the Fourth IP Platform, SFA 350A, for ADAS ASICs
(Image courtesy of Sondrel)

Sondrel launched its new, quad-channel, IP reference platform that has been architected with ISO26262 applications and the integration of customer IP in mind.

Sondrel's IP reference platform is designed to simplify and speed up the creation of the required evidence bundle so the final product can swiftly achieve ISO26262. Per the company, the semi-custom platform approach, which Sondrel calls Architecting the Future, can cut design cost and time to market by up to 30%. 

The SFA 350A IP platform has been designed for ADAS (Advanced Driver Assistance Systems) that are used to support driverless or automotive vehicle applications. It has four channels for sensors that can be either passive, such as optical via camera inputs, or active using LASER or RADAR. This is intended to be a cost-effective solution compared to having a dedicated, one channel chip for each sensor. Uses can include collision avoidance, detection of crossing the central white line, or gathering 3D information via a pair of cameras.


The SFA 350A is designed to be scalable due to its framework architecture design. This enables the processor units for the chip’s four channels to be selected according to the processing power required by the application without requiring any changes to the interconnects and I/O to the rest of the chip. Other solutions can be created by ganging identical, SFA 300 quad-core chips together to form a cluster, which could be less expensive than creating a similar solution on one multi-channel chip. Communication to the vehicle’s central unit is via dual redundant links based on standard protocol such as Ethernet or PCIe.

The Sondrel team includes a number of engineers who have worked on ASICs addressing a range of different markets.

To further reduce risk and time to market, Sondrel offers a full turnkey service that turns designs into fully tested, shipping silicon.

For more information, visit

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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