Embedded Insiders: How Much Are You Willing to Pay for Bad Software?

By Brandon Lewis


Embedded Computing Design

By Rich Nass

Executive Vice President

Embedded Computing Design

By Perry Cohen

Associate Editor

Embedded Computing Design

By Tiera Oliver

Associate Editor

Embedded Computing Design

February 26, 2021

Embedded Insiders: How Much Are You Willing to Pay for Bad Software?

With time to market pressures constantly increasing, technology organizations are moving away from traditional waterfall development workflows and towards Agile/DevOps software development practices.

Originally introduced in enterprise, IT, and data center contexts, these methodologies have made their way into embedded engineering organizations, but at the potential expense of software quality. Can embedded tech companies, especially safety- and security-critical ones, afford to sacrifice quality for speed? Brandon and Rich debate.

Later, the Insiders are joined by Yannick Moy of AdaCore to discuss how the MISRA C coding standard, which was originally developed in 1998, is holding up given the complete overhaul of automotive (and other) technology stacks since the standard’s inception. Is C, a notoriously compliance-challenged language, still the best bet for safety-critical systems that are now operating alongside a host of other connected applications?

Finally, Perry Cohen looks into the true cost of bad software in this week’s Tech Market Madness. After reviewing Herb Krasner’s “The Cost of Poor Software Quality in the U.S.: A 2020 Report,” he finds out just how much defunct software projects, bad legacy code, and operational software failures set back the industry, and considers how DevQualOps could help recoup some of those losses while maintaining time to market. 

Tune in.

Brandon is responsible for guiding content strategy, editorial direction, and community engagement across the Embedded Computing Design ecosystem. A 10-year veteran of the electronics media industry, he enjoys covering topics ranging from development kits to cybersecurity and tech business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached at [email protected].

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Richard Nass’ key responsibilities include setting the direction for all aspects of OSM’s ECD portfolio, including digital, print, and live events. Previously, Nass was the Brand Director for Design News. Prior, he led the content team for UBM’s Medical Devices Group, and all custom properties and events. Nass has been in the engineering OEM industry for more than 30 years. In prior stints, he led the Content Team at EE Times, Embedded.com, and TechOnLine. Nass holds a BSEE degree from NJIT.

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Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation, podcast production, and social media efforts. Perry has been published on both local and national news platforms including KTAR.com (Phoenix), ArizonaSports.com (Phoenix), AZFamily.com, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university.

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Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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