Sensuron releases Summit, a FOS platform that consolidates multiple measurement technologies

By Rich Nass

Contributing Editor

Embedded Computing Design

March 08, 2016

Sensuron releases Summit, a FOS platform that consolidates multiple measurement technologies

Sensuron, a company that specializes in fiber-optic sensing (FOS) systems, recently released its Summit product (Figure 1). Sensuron claims that this...

Sensuron, a company that specializes in fiber-optic sensing (FOS) systems, recently released its Summit product (Figure 1). Sensuron claims that this is the first FOS platform to provide fully distributed sensing with the ability to combine multiple measurement technologies into one platform. With comprehensive and real-time access to data, engineers are better equipped to detect design flaws earlier, saving resources, increasing efficiencies, and preventing costly failures after a product has launched.

[Figure 1]

In general, FOS systems collect and analyze material and structural data based on changes in the way light moves down a fiber-optic cable. They can extract environmental parameters such as strain, loads, and temperature gradients, as well as deflection and 3D shape sensing when light is passed through a network of hair-thin fibers. By measuring the changes in how light reflects back given various changes in these parameters, FOS technology can provide real-time monitoring of applications, helping to ensure the integrity, efficiency, and long-term durability of equipment.

Suited for design, test, mechanical, and stress applications across the automotive, aerospace, and energy industries, Summit lets engineers replace a number of measurement technologies, like strain gauges and thermocouples, with one. In addition, with distributed sensing capabilities, engineers have access to better data and can detect design flaws earlier in product development. Key benefits of the Summit product include greater sensing length, the ability to adjust the sensor, and increased flexibility.

Rich Nass, Embedded Computing Brand Director

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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