The arrival of 5G is expected to bring a dramatic increase in speeds, low latencies, and an unforeseen level of network capabilities. This will set the stage for even more advanced and novel applications enabling everything to be more connected, in real time, all the time.

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Microchip Technology announced the release of the MCP37Dx1-80 family, the company?s second ADC offering. Further, it is also the company?s first offering to combine 80 MSPS in 12-, 14- and 16-bit resolutions; and integrated digital features for a higher temperature range.
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IAR Systems released an update of its Renesas RH850 microcontroller (MCU)-focused build tools supporting implementation in Linux-based frameworks for automated application build and test processes.
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Antenova, a UK-based manufacturer of antennas and RF antenna modules for IoT and M2M applications, released the Lepida SR4L054, a 5G SMD design. The newest addition to the company?s 5G antenna portfolio was developed for enhanced efficiency and performance from 600MHz to 3800MHz.
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This week you could win an STWIN starter kit from STMicroelectronics. The STWIN, which is short for SensorTile wireless industrial node, is a dev kit that?s tailor-made for industrial engineers. It?s built around the STWIN core system board that supports an STM32 MCU, nine different sensors, and industrial connectivity options, all of which help take predictive maintenance to the next level.

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