Embedded Computing Design

Press Releases - Page 33

Consumer
e-con Systems Launches 120 fps Full HD Color Global Shutter Camera Module

January 5, 2021

AI & Machine Learning
Lanner Electronics Announced New Collaboration with Intel, Launches Edge AI Starter Kit

January 4, 2021

Lanner Electronics announced a new collaboration with Intel to launch the Edge AI Starter Kit for industrial automation.
Consumer
OmniVision Announces Release of the OAX8000 AI-enabled ASIC

January 4, 2021

Debug & Test
SEGGER Releases New Server Network

December 30, 2020

SEGGER announced that it is now operating a worldwide network of its J-Link Remote Servers, which allows users to debug target systems from anywhere.
Industrial
Crank Software Teams with Aptera Motors to Drive Embedded UX for the World's First Solar Electric Vehicle

December 30, 2020

Industrial
Plat4mation Releases Factory Digitization

December 28, 2020

Processing
Retune DSP’s Wake Word Engine Available for CEVA DSPs

December 28, 2020

IoT
IBM, mimik to Deliver Network-, OS-Agnostic IoT Edge Computing on Smartphones and Other Mobile Devices

December 24, 2020

Debug & Test
D3 Engineering Automotive-Grade mmWave Radar Sensor Integrates Antenna Array in 1” Package

December 24, 2020

Processing
CHIPS Alliance Presents OmniXtend at RISC-V Summit

December 23, 2020

Industrial
Eurotech Announces Collaboration with Orange

December 23, 2020

Networking & 5G
Product of the Week: Interface Concept ComEth4510e 40 GbE 6U OpenVPX Managed Layer 2+/3 Switch

December 22, 2020

Analog & Power
MagnaChip Introduces First Power Management IC for Laptops with UHD Display Panels

December 21, 2020

Networking & 5G
Menta and Andes Announce Partnership Enabling Hardware Reconfiguring for ISA Extension

December 17, 2020

Industrial
COM-HPC Enters Member Review, PICMG Announces

Perry Cohen

December 15, 2020

AI & Machine Learning
embedded world 2026 Podcast with Axelera AI

March 25, 2026

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IoT
Image Credit: MSI IPC
MSI IPC to Demo Smart Retail, Machine Vision, and Edge AI at Japan IT Week Spring 2026

April 3, 2026

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Networking & 5G
Qualcomm Announces 5G-Advanced Leap with Qualcomm X105 5G Modem-RF

March 4, 2026

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HPC/Datacenters
Embedded Executive: Dealing With the Massive Power Draw in Data Centers | Infineon

March 25, 2026

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