UnitedSiC’s Latest SiC FETs Suited for Mainstream 800-V Bus Architectures
June 13, 2022
Blog
United SiC, now a division of Qorvo, recently announced a next-generation series of 1200-V Silicon Carbide (SiC) FETs with what the company claims is the industry’s best spec for on-resistance.
The UF4C/SC series of Gen 4 FETs are suited for mainstream 800-V bus architectures in onboard chargers for electric vehicles, industrial battery chargers, industrial power supplies, DC-to-DC solar inverters, as well as welding machines, uninterruptible power supplies, and induction heating applications.
All RDS(on) options (23, 30, 53, and 70 mΩ) are offered in industry standard four-lead kelvin source TO-247 packages, providing cleaner switching at higher performance levels. The 53- and 70-mΩ devices are also available in the TO-247 three-lead package. This series of parts have excellent reliability, based on the well-managed thermal performance, which is a result of an advanced silver-sinter die attach and advanced wafer-thinning process.
All 1200-V SiC FETs are included in Qorvo’s FET-Jet Calculator, a free online design tool that allows for instant evaluation of efficiency, component losses, and junction temperature rise of devices used in a wide variety of AC/DC and isolated/non-isolated DC/DC converter topologies. Single and paralleled devices may be compared under user-specified heat-sinking conditions to enable optimum solutions.
In lots of 1000 and up, pricing for the 1200-V Gen 4 SiC FETs ranges from $5.71 for the UF4C120070K3S, to $14.14 for the UF4SC120023K4S.
Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.
Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.
Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.
Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events. In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.
Nass holds a BSEE degree from the New Jersey Institute of Technology.
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