An education at the intersection of IoT and embedded

By Rich Nass

Executive Vice President

Embedded Computing Design

May 11, 2016

An education at the intersection of IoT and embedded

Embedded TechCon moves to Austin this year on June 7th and 8th, and, just like last year, the program consists of 20 hands-on classes that are designe...

Embedded TechCon moves to Austin this year on June 7th and 8th, and, just like last year, the program consists of 20 hands-on classes that are designed to be immediately actionable. In other words, lessons learned during the two days of Embedded TechCon – and in some cases actual hardware and software – can be taken back to the lab and implemented into designs immediately. The motto here is “Everything practical, nothing theoretical.” And we by live it.

The conference will feature a Keynote Address each day. First, Joyce Mullen, VP and GM of Dell OEM Solutions, will share Dell’s pragmatic approach towards making the Internet of Things a reality today. Citing specific examples and case studies, Joyce will share insights on architecting for analytics, the need to put security first, and importance of choice and flexibility.

The Keynote Address on Day 2 focuses two areas that designers can’t seem to get enough information about – the ARM architecture and security – by highlighting ARM TrustZone. Rhonda Dirvin, ARM’s Director of IoT Verticals, will explore key details of how ARM can be the start of a secure solution, but that’s just the tip of the iceberg. She’ll go into the tradeoffs to consider and the various approaches that are available when designing secure systems around ARM IP.

Beyond the two keynotes, this year’s program continues with progressive sessions on pre-silicon software development, IoT operating system tradeoffs, system architectures for big data acquisition and machine learning, and a host of other workshops tuned for embedded and IoT developers. In particular, a track dedicated to heterogeneous computing will address memory architectures, programming models, and best practices for designers working with multiple, dissimilar processors, and a concluding panel session comprised of technical leaders from the HSA Foundation (Paul Blinzer, Fellow at AMD and System Architecture Work Group Chair at the HSA Foundation), Khronos Group (Neil Trevett, Vice President of Mobile Ecosystems at NVIDIA and President of the Khronos Group), and AMD (Amey Deosthali, Director of Embedded Imaging at AMD) will give attendees the opportunity to follow up with any application-specific questions they may have.

In terms of hardware and software giveaways, Renesas will be distributing its Synergy SK-S7G2 Starter Kit, which is aimed at systems featuring Ethernet, USB, CAN, or a wireless medium such as Bluetooth Low Energy. That’s accompanied by two hours of training on how to deploy the Renesas Synergy Software Platform (as well as the ThreadX real-time operating system that comes bundled as part of the kit’s Synergy Software Package (SSP)).

A class led by two Avnet technical experts will teach you how low-cost Microsemi SmartFusion2 development boards equipped with powerful FPGA SoCs and a simple web dashboard can be used to prototype advanced management for IoT systems. At the conclusion of the class, ten attendees will be chosen to take a kit home with them.

As you can see, the schedule is jam-packed with invaluable information, from the Keynote Addresses to hands-on workshops, tutorials, panel sessions, and so on. The show is also co-located with the Design Automation Conference, so Embedded TechCon attendees also have full access to the DAC show floor and proceedings for those interested in the world of IP and chip design.

Early Bird Registration for Embedded TechCon ends May 17th, which can save you a few bucks, too (Full Conference Pass – $395; One-Day Pass – $245; Academia – $99).

We’ll see you in Austin.

Rich Nass, Co-Chair, Embedded TechCon 2016

[email protected]

Brandon Lewis, Co-Chair, Embedded TechCon 2016

[email protected]

Rich Nass, Embedded Computing Brand Director

Richard Nass’ key responsibilities include setting the direction for all aspects of OSM’s ECD portfolio, including digital, print, and live events. Previously, Nass was the Brand Director for Design News. Prior, he led the content team for UBM’s Medical Devices Group, and all custom properties and events. Nass has been in the engineering OEM industry for more than 30 years. In prior stints, he led the Content Team at EE Times,, and TechOnLine. Nass holds a BSEE degree from NJIT.

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