A Single Common Conformance Test Plan For The IEC/IEEE 60802 TSN Profile For Industrial Automation Will Be Made Available
June 10, 2022
News
The Avnu Alliance, CC-Link Partner Association, ODVA, OPC Foundation, and PROFIBUS & PROFINET International have joined forces to produce a single conformity test plan for the IEEE/IEC 60802 Time Sensitive Networking (TSN) profile for Industrial Automation.
All of the participating firms will use the test plan as a baseline, and it will be made available to the broader Industrial Automation ecosystem. End users will have more confidence in 60802 conformant devices from different manufacturers that support multiple automation protocols coexisting consistently at the TSN level on shared networks, even with devices that use TSN for purposes other than automation, thanks to the joint venture.
The collaboration's main goal is to develop a jointly agreed-upon and owned test strategy for the industrial automation sector. This formal partnership adds value by providing a platform for all of these groups to collaborate and share ideas toward the end goal of interoperability and coexistence on open, standard networks for all protocols, without the need to form a separate, official organization. The collaborative efforts shall be referred to as "TIACC" for convenience (TSN Industrial Automation Conformance Collaboration).
The TIACC represents these organizations' commitment to provide an interoperable ecosystem of devices from various manufacturers that comply with the IEC/IEEE Standards Association 60802 profile and allow end-users to deploy these devices on open, standard networks with confidence.
After the IEC/IEEE 60802 profile is published, the intention is to have the final version of the single, shared test plan available as soon as possible.
“Avnu’s purpose and mission is to transform standard networks to enable support for many time sensitive applications and protocols in an open, interoperable manner. This collaboration among organizations will be critically important to facilitating coexistence of multiple workloads and protocols according to IEEE 60802 on a network, while leveraging foundational network interoperability that is used across industries,” said Greg Schlechter, Avnu Alliance President. “We are committed to working with the industries to enable an interoperable ecosystem of devices that allow end users to confidently deploy on open, standard, and converged networks.”
“The creation of the Connected Industries of the future requires different systems and devices to communicate in order to deliver the necessary process transparency required. This is a core principle for the CLPA and is at the root of why the organization was founded. This is why we are delighted to be part of the TIACC and look forward to supporting the creation of a unified, common test plan for TSN-compatible products. By doing so, we can help further boost the adoption of futureproof technologies for smart manufacturing,” said Manabu Hamaguchi, Global Director at CLPA.
“EtherNet/IP users will be able to take advantage of the benefits afforded by 60802 TSN of enhanced network performance, higher utilization, and guaranteed network access for multiple time-critical applications with different priorities. ODVA’s participation in TIACC will ensure that the full potential of 60802 TSN coexistence is realized by end users to help make Industry 4.0 and IIoT a reality,” said Dr. Al Beydoun, President and Executive Director at ODVA.
“OPC UA is a secure, vendor-independent communication solution that fully scales from the field to the cloud and offers semantic interoperability. Other underlying IT infrastructure such as Ethernet TSN and the IEC/IEEE 60802 TSN Profile for Industrial Automation open up further applications for the market. We believe this conformance collaboration is an important contribution to preparing and delivering streamlined and effective conformance testing and certification to the industry in collaboration with other SDOs,” said Stefan Hoppe, President and Executive Director of the OPC Foundation.
“At PI we are taking conformance testing very seriously. It’s our belief, that thought-out testing ensures cross-vendor interoperability. That’s why we invested huge efforts in our test system in recent years. With this joint initiative we are taking the next step towards converged networks utilizing TSN, giving our users the confidence in the future-readiness of PROFINET. This collaboration is a huge milestone on the way of the digital transformation,” said Karsten Schneider, Chairperson of PROFIBUS and PROFINET International (PI).
Learn more about the TSN Industrial Automation Conformance Collaboration #TIACC here: https://www.tiacc.net/
Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.
