Embedded Executive: Rajinder Cheema, SVP of Engineering, Socionext America

By Rich Nass

Executive Vice President

Embedded Computing Design

January 19, 2022

Embedded Executive: Rajinder Cheema, SVP of Engineering, Socionext America

The discussion of SoC versus ASSP has been going on for as long as these devices have existed.

The pendulum seems to shift over time, depending on which applications are hot at the moment (is there currently a killer app?), how much the manufacturing costs are, and a host of other factors. To understand where the discussion sits today, I spoke to Rajinder Cheema, the Senior Vice President of Engineering at Socionext America in this week’s Embedded Executives podcast.

 

Richard Nass’ key responsibilities include setting the direction for all aspects of OSM’s ECD portfolio, including digital, print, and live events. Previously, Nass was the Brand Director for Design News. Prior, he led the content team for UBM’s Medical Devices Group, and all custom properties and events. Nass has been in the engineering OEM industry for more than 30 years. In prior stints, he led the Content Team at EE Times, Embedded.com, and TechOnLine. Nass holds a BSEE degree from NJIT.

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