congatec Announces First COM-HPC and Next-Gen COM Express
September 22, 2020
congatec fuels launch of 11th Gen Intel Core processors with two new design options
In parallel with the 11th Gen Intel Core processor launch (code named "Tiger Lake"), congatec announced the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module.
According to the company, both solutions are designed to provide engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC's broader interfaces. Also, per the company, OEMs will benefit from the performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel Core processors deliver to the high-end computing sector.
Besides PCIe Gen 4, the new congatec Computer-on-Modules with low-power 11th Gen Intel Core processors also offer USB 4.0, which is based on Intel's Thunderbolt technology. USB 4.0 supports ideal data transfer rates of up to 40 Gbit/s and tunneling of PCIe 4.0 as well as DP-Alt mode supporting video signals of up to 8k resolution with 10-bit HDR at 60 Hz.
The COM-HPC Client size A module conga-HPC/cTLU as well as the COM Express Compact conga-TC570 will become available with the 11th Gen Intel Core processors. According to the company, both modules are the first to support PCIe x4 in Gen 4 quality to connect external peripherals with large bandwidth. In addition, designers can leverage 8x PCIe Gen 3.0 x1 lanes. Where the COM-HPC module offers latest 2x USB 4.0 and 2x USB 3.2 Gen 2 and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification.
Sound is provided via I2S, SoundWire by COM-HPC, and HDA by COM Express modules. Comprehensive board support packages are provided for all leading OS's like Linux, Windows, and Chrome, as well as hypervisor support from Real Time Systems.
For more information, visit: congatec.com/11th-gen-intel-core/