When the Chips Are Down: Feedback from the Semiconductor Shortage

By Brandon Lewis

Editor-in-Chief

Embedded Computing Design

By Rich Nass

Executive Vice President

Embedded Computing Design

By Perry Cohen

Associate Editor

Embedded Computing Design

April 23, 2021

When the Chips Are Down: Feedback from the Semiconductor Shortage

In this episode of the Embedded Insiders, Brandon and Rich discuss Silicon Laboratories recent divestiture of its infrastructure and automotive business units to SkyWorks Solutions. The sale includes the company’s power, isolation, broadcast, timing, and other products and IP. Silicon Labs CEO Tyson Tuttle said several years ago that the company is “all-in” on IoT, and this move appears to be him keeping his word. But was it the best move?

Afterwards, Rich is rejoined by Zane Tsai, Director of the Platform Product Center at ADLINK, and Amit Goel, Director of Product Management for Embedded AI Platforms at NVIDIA. After discussing enabling technologies in previous episodes, the three get down to how this functionality can be applied to autonomous mobile robots. The market opportunity for AMRs is vast, but so are the challenges. The three dive into a collaboration between ADLINK, NVIDIA, and BMW to increase productivity, improve efficiency, and reduce cost in the German automakers manufacturing facilities.

Finally, Perry Cohen investigates the long tail of the ongoing semiconductor shortage, and how market dynamics that limited the supply of multi-layer ceramic capacitors back in 2018 are playing out again in the broader electronics market. Of all the sectors feeling the squeeze, none has been pinched more than automotive. Why is that, what can be done about it, and how long until things are back to normal? Richard Barnett of SupplyFrame helps explain that our definition of normal may need to change.

Tune in.

 

Brandon is responsible for guiding content strategy, editorial direction, and community engagement across the Embedded Computing Design ecosystem. A 10-year veteran of the electronics media industry, he enjoys covering topics ranging from development kits to cybersecurity and tech business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached at [email protected].

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Richard Nass’ key responsibilities include setting the direction for all aspects of OSM’s ECD portfolio, including digital, print, and live events. Previously, Nass was the Brand Director for Design News. Prior, he led the content team for UBM’s Medical Devices Group, and all custom properties and events. Nass has been in the engineering OEM industry for more than 30 years. In prior stints, he led the Content Team at EE Times, Embedded.com, and TechOnLine. Nass holds a BSEE degree from NJIT.

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Perry Cohen, associate editor for Embedded Computing Design, is responsible for web content editing and creation, podcast production, and social media efforts. Perry has been published on both local and national news platforms including KTAR.com (Phoenix), ArizonaSports.com (Phoenix), AZFamily.com, Cronkite News, and MLB/MiLB among others. Perry received a BA in Journalism from the Walter Cronkite School of Journalism and Mass Communications at Arizona State university.

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