Embedded Insiders: Defining Digital Twins

By Brandon Lewis

Editor-in-Chief

Embedded Computing Design

July 09, 2020

Embedded Insiders: Defining Digital Twins

In this edition of the Embedded Insiders, Brandon and Rich are joined by Brady Benware, VP and general manager of the tessent portfolio at Mentor, a Siemens business.

 

In this edition of the embedded insiders, Brandon and Rich discuss how digital twins that reflect physical IoT systems can not only record the status of real-world devices, but simulate how the device could react under certain conditions in the future. And, how these twins can also potentially be used to help inform future designs.

Later, the insiders are joined by Brady Benware, VP and general manager of the Tessent portfolio at Mentor, a Siemens business. The company recently acquired UltraSoC, who focuses on on-chip analytics, among other things, perhaps allowing Siemens to address the concept of digital twins all the way down to the chip level.

After, Jean Labrosse is back with “things that annoy a veteran software engineer” where he explains why the inconsistent use of acronyms and abbreviations bothers him.

Tune in.

Brandon is responsible for guiding content strategy, editorial direction, and community engagement across the Embedded Computing Design ecosystem. A 10-year veteran of the electronics media industry, he enjoys covering topics ranging from development kits to cybersecurity and tech business models. Brandon received a BA in English Literature from Arizona State University, where he graduated cum laude. He can be reached at [email protected].

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