WINSYSTEMS Expands SBC Lineup with High-Performance Xeon-Powered Embedded Computers

By Chad Cox

Production Editor

Embedded Computing Design

July 17, 2025

News

WINSYSTEMS Expands SBC Lineup with High-Performance Xeon-Powered Embedded Computers
Image Credit: WINSYSTEMS

WINSYSTEMS announced two new high-performing embedded computers to its small form factor SBC lineup, the SBC-472-TS570 and SBC-477-TS570. Building upon the demonstrated dependability of the SBC-472 and SBC-477 families, the additions include a more powerful processor (Intel Xeon® W-11865MRE) for superior computing power in industrial applications.

The solutions support high-speed connectivity, flexible expansion options, and robust thermal management to withstand extreme environments. Both integrate COM Express Type 6 Basic modules on same-size carriers in a 125mm x 95mm modular design for space-constrained rugged applications. Operating temperatures range from -40°C to +85°C. Expansion options consist of Mini PCIe, USB 3.0, SATA, and Gigabit Ethernet for flexible connectivity.

OS compatibility includes Linux, Windows 10/11 IoT, and other x86 real-time operating systems

“The SBC-472-TS570 and SBC-477-TS570 represent a significant leap forward in the performance of our embedded solutions portfolio,” said Robert Dunaway, Chief Revenue Officer at WINSYSTEMS. “With the Intel® Xeon® processors, these embedded computers empower customers to implement rugged, high-performance solutions for industrial automation, transportation, and energy applications.”

For more information, visit winsystems.com/winsystems-expands-rugged-embedded-computing-line-with-high-performance-additions/.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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