AI-Ready Wincomm WTP-9K66 Fanless Panel PCs Combine Hybrid CPU/NPU/GPU Architecture
March 18, 2026
News
Wincomm officially released its new flagship fanless industrial panel PC series featuring the 15” WTP-9K66-15 and the 21.5” WTP-9K66-22. The series was recently honored with the 2026 Taiwan Excellence Award, earned for Wincomm’s innovations in performance, hygiene, and sustainability for smart manufacturing and the food-pharma industries. The platforms leverage the latest Intel Core Ultra 125U processor and highlight a hybrid CPU/NPU/GPU architecture, delivering up to 22.5 TOPS AI performance at only 15 W power consumption. For secure, enterprise-grade management, the PCs incorporate TPM 2.0 on board and support Intel vPro Technology.
The system chassis is designed with CNC-machined SUS 304/316 stainless steel and comes with an IP66/69K rating. According to the company, the series offers a 100 percent waterproof guarantee with an antibacterial and anti-corrosion enclosure.
For continuous operation at operating temperatures ranging from -20 to 50 °C, the series includes Wincomm's proprietary i-Control thermal and power management technology. A bezel-free, full flat P-Cap touch panel supports normal, glove, and water modes with modular configurations that include optional IP67 M12 stainless connectors for highly secure waterproof I/O.
The solutions conform to RoHS/REACH and support ISO 14067 carbon footprint tracking while utilizing recyclable materials. The series is globally certified to CE, FCC, and VCCI Class B standards
For more information, visit wincomm.com.tw.
Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.
