Dialog Semiconductor Connects Industry 4.0 Devices with Optimized IO-Link IC

By Rich Nass

Contributing Editor

Embedded Computing Design

March 17, 2020

News

Dialog Semiconductor Connects Industry 4.0 Devices with Optimized IO-Link IC

Dialog Semiconductor recently released its newest member of its IO-Link product family, the CCE4503.

Dialog Semiconductor  recently released its newest member of its IO-Link product family, the CCE4503. This IC both expands the company’s reach into the Industrial IoT (IIoT) market and reduces both the size and cost of the IO-Link Device sensors and actuators. IO-Link is a standardized, serial bi-directional, point-to-point communication technology (IEC 61131-9) that’s aimed at industrial automation networks. It provides robust communications for the last meters between sensors, actuators, and any fieldbus within a network.

The CCE4503 is a robust and easy-to-use device-side IO-Link-compliant transceiver that combines IO-Link standard communications with advanced protection circuitry and low power dissipation, within a tiny DFN10 3x3mm package. It also integrates an LDO, further reducing cost. As a result, developers can add IO-Link connectivity to space-constricted industrial sensors and actuators.

The CCE4503, now sampling, is supported by a comprehensive set of development support tools, industry standard IO-Link software and a full-featured customer evaluation board. For more information, see the video.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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