SC19: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Five-Meter Samtec Cable Assembly

November 26, 2019

Press Release

SC19: eSilicon to Demonstrate 7nm 58G DSP-Based SerDes Over Five-Meter Samtec Cable Assembly

eSilicon and Samtec co-developed system-level solutions that emulate next-generation data center architectures for typical 19-inch rack-mount applications

eSilicon, a provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, and Samtec, will demonstrate eSilicon's 7nm 58G DSP-based PAM4/NRZ SerDes capabilities for challenging data center applications over a five-meter Samtec cable assembly.

What:

eSilicon and Samtec have co-developed system-level solutions that emulate next-generation data center architectures for typical 19-inch rack-mount applications.

eSilicon will demonstrate its SerDes operation over two 67cm AcceleRate Slim Body Cable Assemblies and a five-meter (16-foot) ExaMAX Backplane Cable Assembly providing mid-board to backplane communications via a cabled backplane architecture from Samtec. This demonstration highlights eSilicon's 7nm 58G PAM4 and NRZ full-DSP long-reach SerDes architecture's flexibility in supporting independent data rates and protocols on each individual lane, e.g., 50G PAM4 Ethernet, 24G NRZ CPRI and proprietary protocols up to 58Gb/s.

A broad set of monitoring and diagnostic tools are available through eSilicon's SerDes evaluation module kit and its graphical user interface to control, observe and analyze signal quality and performance metrics across the link in real time, including:

Bit error rate (BER) monitor
Eye diagram monitor
Equalization capabilities
Error histogram monitor with post-FEC estimator

For more information, please visit: https://www.esilicon.com/