Danfoss Secures Capacities for Electro-Mobility Chips at Infineon
June 23, 2020
News
Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit.
Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles.
Infineon produces the IGBTs and diodes for Danfoss at its plants in Dresden, Germany, and Villach, Austria. Danfoss manufactures its power modules in Flensburg, Germany, and Utica, New York, USA.
For more information, visit: https://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFATV202006-067.html
Tiera Oliver, Assistant Managing Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She develops content and constructs ECD podcasts, such as Embedded Insiders. Before working at ECD, Tiera graduated from Northern Arizona University, where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student-led newspaper, The Lumberjack.
