Danfoss Secures Capacities for Electro-Mobility Chips at Infineon
June 23, 2020
News
Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit.
Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles.
Infineon produces the IGBTs and diodes for Danfoss at its plants in Dresden, Germany, and Villach, Austria. Danfoss manufactures its power modules in Flensburg, Germany, and Utica, New York, USA.
For more information, visit: https://www.infineon.com/cms/en/about-infineon/press/market-news/2020/INFATV202006-067.html
Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.
She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.
Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack.
