Compex Debuts EasyMesh-Ready Wi-Fi⁷ Module with MLO and Tri-Band Support

By Chad Cox

Production Editor

Embedded Computing Design

June 11, 2025

News

Compex Debuts EasyMesh-Ready Wi-Fi⁷ Module with MLO and Tri-Band Support
Image Credit: Compex

Compex recently released its Just Wi-Fi⁷ Wi-Fi module developed for speed, simplicity and scalability. Unlike general Wi-Fi module design, the Wi-Fi⁷ connects via Ethernet protocols (10Gbps) as the host uses the module as an Ethernet port. Wi-Fi decisions like Multi-Link Operation (MLO), etc. are managed inside the module.

Integrations such as requiring kernel-specific driver or host-side firmware is considerably reduced as is integration complexity while increasing cross-platform compatibility from Intel x86 to ARM-based System on Chip (SoCs), like NXP and Marvell, regardless of operating system.

The module leverages Qualcomm’s IPQ5322 Quad-Core Cortex-A53 1.5GHz ‘Miami’ SOC and QCN9274 ‘Waikiki’ radio chipset delivering true concurrent tri-band connectivity across 2.4GHz, 5GHz, and 6GHz in a board around the dimensions of two standard Mini PCIe adapters.

Highlights:

  • Driverless Ethernet Integration
  • Standalone & Host-Independent Design
  • True Tri-band Wi-Fi 7
  • MLO Without Hassle
  • Flexible Configuration
  • EasyMesh Capable
  • Accelerated Time to Market

“Just Wi-Fi⁷ is more than a product; it’s a step forward,” said, Jonathan Ho, Managing Director of Compex Systems Pte Ltd. “We’re giving developers and businesses a way to bring powerful Wi-Fi 7 solutions to market faster without the usual complications.”

For more information, visit compex.com.sg/.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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