Quectel Wireless Solutions released a series of Wi-Fi 6 modules, including the industrial-grade FG50X series based on the Qualcomm FastConnectTM 6800 mobile connectivity subsystem, and the AF50T based on the Qualcomm Automotive Wi-Fi 6 chip. Both module series were developed for enhanced performance in capacity, data rates, latency, power consumption, and coverage.

Per the company, the FG50X series and AF50T modules support IEEE 802.11 ax and BT 5.1, and are backward compatible with 802.11a/b/g/n/ac protocols. In addition to this, the low-power Wi-Fi 6 modules support Dual MAC, 2.4 GHz and 5 GHz Dual Bands Simultaneous (DBS) in 2X2+2x2 mode, MU-MIMO with 8x8 sounding, advanced Orthogonal Frequency Division Multiple Access (OFDMA) and 1024-QAM (Orthogonal Amplitude Modulation) capabilities.

"Our investment in Wi-Fi 6 began at the earliest stages of this new technology, and we are delighted to see that Quectel's solutions, powered by our leading-edge Wi-Fi 6 technology, are accelerating adoption and transforming indoor and automotive wireless experiences," said vice president of mobile compute and connectivity at Qualcomm Technologies Dino Bekis, in a press release. "The increased capacity, high power efficiency and enhanced indoor coverage capabilities of the Quectel Wi-Fi 6 modules will play an important role in ushering in the next wave of IoT devices' connectivity."

Coupling Quectel's 5G module RG500Q with the FG50X series, a 5G and WiFi 6 solution is developed for MiFi and CPEs to enhance the speed of connection, which can support up to 32 clients at a time. The combination could also reduce network congestion within complex indoor scenarios such as schools, factories, and malls.

For more information, visit https://www.quectel.com/product/af50t.htm