AUTOMOTIVE Embedded Systems

Tuesday 6/16

Crystal Group
The price of the multilayer ceramic capacitors (MLCCs) has risen sharply over the past several years, tracking the expansion in the number of power supplies used in the automotive industry. For instance, the proliferation of the advanced driver assistance systems (ADAS) in automobiles has dramatically increased ceramic capacitor usage rates.

The quest to increase the performance of industrial and automotive systems calls for increases in data processing speed of several orders of magnitude, with an increasing number of power-hungry devices squeezed into microprocessors, CPUs, system on chips (SoCs), ASICs, and FPGAs.
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The MIPI Alliance has completed the A-PHY v1.0 interface specification for automotive data transfer, a long-reach SerDes interface that operates as a point-to-point asymmetric data link.
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NI announced its first ever, purpose-built ECU Test System offering which assists Tier 1 suppliers in end-of-life testing.
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The VA7000 serializers and deserializers target ultra-high-speed networking applications in ADAS and autonomous drive subsystems.
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Toshiba Electronics Europe GmbH has added two new display interface bridge ICs to their product lineup for automotive in-vehicle infotainment (IVI) systems.
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The BLM18SP_SH1 series features the world?s smallest single-chip ferrite beads for noise suppression in automotive power supply applications.
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Imagination Technologies announced that Nanjing SemiDrive Technology (SemiDrive) is using Imagination?s PowerVR Series9XM GPU in its smart cockpit chip X9.
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The SmartFusion 2 FPGA SoCs on the Hello! Kit is a flash-based FPGA device that packs in 12,000 logic elements, 21 18K LSRAM blocks, 22, 1K ?SRAM blocks, 22 math blocks that can be cascaded for DSP functions, and 2 programmable logic libraries and clock conditioning circuits.
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